Job Description

Basic Purpose of the Job

The Wire Bond Process Engineer (Thermosonic) own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires wide semiconductor manufacturing experience spanning materials, tooling, and equipment capability across Au/Al/Cu wires and diverse package families in fast past manufacturing set‑up.

Reporting Relationship

Reports directly to FOL Process Engineering Team Lead.

Major Duties and Responsibilities

• Define, sustain and optimize key wirebonding parameters and tooling effectiveness.
• Establish and maintain the recipe management system, process/set‑up controls, process capability, process performance (Ppk) and SPC health for wire pull and bond shear.
• Generate and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans ...