**I. Basic Purpose of the Job**

•The **Ultrasonic Wire Bond Process Engineer** owns, characterizes, and sustains **ultrasonic wire bonding processes** to deliver robust interconnect quality, high yields, and reliable semiconductor packages. This role requires strong semiconductor manufacturing experience across materials, tooling, equipment capability, and process optimization, supporting Al and Al‑based wire interconnects across diverse package families in a fast‑paced manufacturing environment.



**II. Reporting Relationship**

•Reports directly to the FOL Process Engineering Team Lead

**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innov...