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Thermal Design Engineer, Hardware Development Engineer II
Amazon
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El Segundo, United States
Location
El Segundo
Posted
June 03, 2026
Commute
Local Area
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Job Description
Description
Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to un-served and under-served communities around the world.
The mission of Amazon Leoβs Government (ALG) team is to leverage existing Amazon Leo technology and provide high speed, low latency, and secure satellite broadband services to the United States and our allied government customers.
ALG is looking for a Thermal Design Engineer who combines superb technical and analytical capabilities with a demonstrated ability to get the right work done quickly and effectively. This person must have experience working in spacecraft design, producing top notch thermal analysis, testing support, and providing essential thermal related input and recommendations to vehicle architects and subsystem leads.
Key job responsibilities
β’ Detailed and comprehensive analysis of bus and payload subsystems, components ...
Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to un-served and under-served communities around the world.
The mission of Amazon Leoβs Government (ALG) team is to leverage existing Amazon Leo technology and provide high speed, low latency, and secure satellite broadband services to the United States and our allied government customers.
ALG is looking for a Thermal Design Engineer who combines superb technical and analytical capabilities with a demonstrated ability to get the right work done quickly and effectively. This person must have experience working in spacecraft design, producing top notch thermal analysis, testing support, and providing essential thermal related input and recommendations to vehicle architects and subsystem leads.
Key job responsibilities
β’ Detailed and comprehensive analysis of bus and payload subsystems, components ...