The Wire Bond Process Engineer (Thermosonic) owns, characterizes, and sustains the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires wide semiconductor manufacturing experience spanning materials, tooling, and equipment capability across Au/Al/Cu wires and diverse package families in fast past manufacturing set-up.

Responsibilities

Process Ownership & Control

• Define, sustain and optimize key wirebonding parameters and tooling effectiveness.
• Establish and maintain the recipe management system, process/set‑up controls, process capability, process performance (Ppk) and SPC health for wire pull and bond shear
• Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)

Yield & Quality Improvement

• Troubleshoot and drive actions on critical wire bond losses: Deformed bond, NS...