The Company

Halo Industries has invented a technology to replace a decades-old semiconductor material wire saw slicing process that wastes billions of dollars annually in high-value materials.

Halo’s laser-based technology eliminates this waste from the silicon carbide (SiC) substrate manufacturing process, delivering improvements in both material cost and performance, while enabling accelerated growth for a diverse set of high-growth application markets, including the electric vehicle, grid infrastructure, industrial HVAC and other high-voltage power electronics sectors.

Halo originally spun out of Stanford University in 2014, acquiring a significant series A round of VC funding in 2020 following the successful demonstration of the company’s precision material slicing equipment. Having recently closed on an $80M+ B round of VC funding, Halo is driving the fast-scale growth of the company’s team and manufacturing operations.

Halo Industries i...