Responsibilities

• Perform full physical failure analysis on Memory, IoT, USB and Microcontroller, and write failure analysis report.
• Liaise with relevant engineering groups on analysis and corrective actions.
• Spearhead development of new analysis techniques to meet technology and device challenges.
• Take ownership of certain tools and equipment.

Qualifications

• Bachelor in Electronics/Electrical/Microelectronics/Material Engineering, Material Science, Physics or Chemistry.
• Minimum 5-8 years’ experience in silicon level failure analysis on IC failure.
• Preferable with knowledge related to semiconductor and physics.
• Familiarity with bench test setup and verification, fault isolation equipment/technique such as OBIRCH, Photon and thermal emission.
• Familiarity in die de-processing and proficiency in operating advanced failure analysis tools (e.g. FESEM, FIB, nano-probing)...