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Job Description
Key Responsibilities
- Take on wire bonding (WB) process development for new products and packages (e.g., Cu/Au wire), including establishing process window and bonding conditions independently.
- Drive NPI activities covering development validation, data analysis, yield improvement, SPC and reporting.
- Perform trouble shooting and drive continuous quality improvement and process stabilization.
- Manage new material introduction (e.g., bonding wire, lead frame, substrate, plating solution, capillary) and optimize process parameters to improve productivity and reduce cost.
- Define and maintain WB process specifications, standard procedures and support reliability evaluation and risk assessment.
- Understand equipment and tooling principles and continuously optimize related specifications and configurations.
Qualifications
- Bachelor’s degree or above in Engineering or related fields.
- At le...