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Sr. Engineer – CMP/Bond Equipment Development

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Micron Technology, Inc.
📍 Boise, United States
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Location Boise
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Posted June 03, 2026
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Commute Local Area
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Job Description

**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsible for developing and optimizing next generation, first of a kind (FAOK) wafer bond equipment (bond, trim, grind, and others) to improve capability, productivity and cost of such equipment. Work from conception through equipment and sub-component development to implementation in TD and manufacturing facilities. Identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Coordinate and carry out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities. Interact with variou...

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📍 Location Details

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City
Boise
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Country
United States
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Commute
Local Area

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