Description

The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes.

BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.

You will be a key member of our highly integrated multi-disciplinary team of software, systems, applications and algorithm engineers.