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Senior/Staff Process Engineer (Wafer Dicing & Back-grind)
Lumilens
📍
, penang, malaysia, Malaysia
Location
, penang, malaysia
Posted
June 24, 2026
Commute
Local Area
Local Opportunity Near You!
This job is in your area. Enjoy a short commute and work close to home.
Job Description
- Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line.
- Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers.
- Solve process abnormalities in wafer thinning and dicing processes, including wafer warpage, surface scratch, incomplete cutting and chip breakage.
- Monitor wafer thickness uniformity, cutting quality and production capacity, carry out continuous process optimization to improve product yield.
- Evaluate process compatibility between wafer grinding/stealth dicing and bumping & flip-chip processes, optimize process integration to avoid subsequent process failure attributed to front-end process variations.
- Compile process SOP, WI, failure reports and engineering change d...