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Senior/Staff HBM PYE Product Development Failure Analysis Engineer
Micron Technology, Inc.
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Boise, United States
Location
Boise
Posted
June 20, 2026
Commute
Local Area
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This job is in your area. Enjoy a short commute and work close to home.
Job Description
**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As an HBM PYE PDFA Engineer, you will work on the Product Development Failure Analysis team to take next generation HBM devices from design to mass production!
You will focus on product reliability and component failure analysis at new HBM product introductions to enable rapid production ramp and early time to market. This position requires the use of electrical and physical characterization techniques combined with AI tools and statistical analysis to identify failures introduced by fabrication and assembly process, as well as testing marginalities. You will be responsible for communicating and coordinating component-level improvement activitie...
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As an HBM PYE PDFA Engineer, you will work on the Product Development Failure Analysis team to take next generation HBM devices from design to mass production!
You will focus on product reliability and component failure analysis at new HBM product introductions to enable rapid production ramp and early time to market. This position requires the use of electrical and physical characterization techniques combined with AI tools and statistical analysis to identify failures introduced by fabrication and assembly process, as well as testing marginalities. You will be responsible for communicating and coordinating component-level improvement activitie...