Onsemi is seeking a Staff Process Engineer (Wirebond) based in Seremban, Negeri Sembilan, Malaysia. The role requires a BS in Engineering and over 10 years of experience in semiconductor manufacturing, particularly in wirebond thermosonic bonding. Responsibilities include managing the wire bond process, optimizing parameters, and leading problem-solving initiatives. The position offers benefits such as insurance, medical, and shift allowances, and adheres to local labor laws.
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