**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

You will drive physical implementation of advanced high‑bandwidth memory (HBM) system‑on‑chip (SoC) logic and base die designs from netlist through GDSII within the Heterogeneous Integration Group.
You will collaborate closely with design, verification, design for test (DFT), packaging, and manufacturing teams to deliver best‑in‑class performance, power, and area (PPA) with robust signoff collateral.
This is a hands‑on role where you can own blocks or top‑level integration across multiple product generations and see your work through tapeout and silicon.

Job Description

**Responsibilities will include, but are not limited to:**