Job Title

Advanced Packaging Module Senior Research Engineer

Position Overview

We are seeking a highly skilled and motivated Research Engineer / Senior Research Engineer to drive the development and optimization of advanced wafer level packaging processes. This role offers the opportunity to work on groundbreaking technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.

Key Responsibilities

• Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan‑Out Wafer‑Level Packaging (FOWLP), and C2W hybrid bonding through pathfinding, feasibility assessment, technical risk evaluation, and capability development focusing on pre‑assembly processes such as Automated Optical Inspection, backgrinding, dicing and IR metrology.
• Plan, coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qu...