We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.

The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Key Responsibilities