Responsibilities:

• To perform qualification on semi-conductor packaging equipment through verification of machine calibration, setup and process bonding on semiconductor packaging equipment.
• Identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time.
• Develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) for manufacturing usage.
• Recommend enhancements to process recipes, process tooling or manufacturing processes to ensure excellent manufacturing process coverage of semiconductors packaging equipment to their bonding functionalities.
• Establish PFMEA process testing for customized kits to ensure machine is performing to customer’s requirements.
• Ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes.
• Setup and ...