As a Senior Mechanical Engineer within the Ball Bonder Business Unit's Mechanical Engineering organization, this position will be dedicated to the mechanical development of new wire bonding equipment as well as the continuous improvement support of existing products. Responsibilities: Responsible for high accuracy/speed motion subsystem's mechanical development and existing product enhancement. Responsible for implementation, structural analysis, modification and verification testing of semiconductor equipment based on overall system specifications Work on a broad range of activities such as hands-on detailed mechanism design, using analytical skills in subsystem design, identifying the root cause of technical issues as well as some customer support. Collaborate with supplier for fabrication, test and ensure delivery of final products to customer successfully.
Qualifications: 5 or more years working experience in mechanical subsystem design & test in semiconductor equipment areas. A...