Bonding Process Control Engineer – Role Summary

We are seeking a Bonding Process Control Engineer responsible for owning, optimizing, and sustaining wafer‑level bonding processes—including hybrid wafer‑to‑wafer bonding, chip‑to‑wafer bonding, and Temporary Bonding & Debonding (TBDB) across multiple wafer sizes and thicknesses. This role focuses on process stability, SPC governance, yield improvement, defect reduction, and robust process‑control strategies for both development and small‑volume prototyping. The engineer will play a critical role in enabling next‑generation heterogeneous integration and advanced packaging technologies.

Process Control & SPC Ownership

• Own and maintain SPC control strategies for bonding processes across multiple toolsets.
• Define Critical Process Parameters (CPPs) and Critical Quality Attributes (CQAs) such as alignment accuracy, bond strength, defectivity, warpage, and thickness.
• Establish and opti...