Bonding Process Control Engineer ? Role Summary

We are seeking a Bonding Process Control Engineer responsible for owning, optimizing, and sustaining wafer?level bonding processes?including hybrid wafer?to?wafer bonding, chip?to?wafer bonding, and Temporary Bonding & Debonding (TBDB) across multiple wafer sizes and thicknesses.

This role focuses on process stability, SPC governance, yield improvement, defect reduction, and robust process-control strategies for both development and small?volume prototying. The engineer will play a critical role in enabling next?generation heterogeneous integration and advanced packaging technologies.

Key Responsibilities:

Process Control & SPC Ownership