As a Senior / Process Engineer in Advanced Packaging, you will bring your research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

• Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• Perform materials and process characterization to evaluate film quality, reliability, and performance.
• Analyze experimental ...