Job Description
Our client, a global leader in materials and solutions for advanced electronics, is seeking a highly skilled and innovative engineer to lead our Copper Hybrid Bonding (CHB) development program. This role will focus on advancing next-generation interconnect technologies for high-performance packaging, leveraging deep expertise in grain engineering, copper bonding, and process integration.

Key Responsibilities

- Drive end-to-end development of copper hybrid bonding processes for advanced packaging and 3D integration.
- Define technical roadmap, milestones, and deliverables aligned with business objectives.
- Collaborate with materials innovation and formulation teams to develop novel electroplated Cu for low temperature bonding processes.
- Develop and optimize copper surface preparation, grain structure control, and bonding interface engineering to meet industry goals for CHB.
- Implement advanced characterization techniques (e.g., EBSD, ...