Role in a nutshell

Lead the end‑to‑end equipment and material sourcing for a greenfield semiconductor assembly and testing facility, ensuring uninterrupted availability, quality, compliance, and cost effectiveness of direct and indirect materials required for process qualification, ramp‑up, and steady‑state production.

The role is accountable for building a world‑class, resilient, and compliant equipment and materials supply ecosystem from zero—covering dicing saws, die bonders, wire bonders, molding presses, trim & form systems, AOI/X‑ray/SAM inspection tools, burn‑in chambers, and automated test equipment (ATE) along with handlers, SMT Process eqpt, die attach materials like epoxy adhesives, sinter paste, solder, bonding wires (Au, Cu), lead frames or substrates, epoxy molding compound (EMC), gels, plating metals, marking supplies, solder balls, flux, underfill, tape & reel, moisture barrier bags, cleaning solvents, ESD items, machine consumables, chem...