Responsibilities

Lead local Hybrid Bonding equipment full-cycle R&D, architecture design, technical breakthrough and iteration.

Connect with local & Southeast Asian OSAT/wafer fabs, match HBM, Chiplet, 3D stacking process demands, deliver technical solutions.

Oversee precision mechanism, nano alignment, motion control, vacuum & temp-pressure control, electrical and software system integration & debugging.

Complete prototype tuning, accuracy optimization, yield improvement and customer acceptance, resolve mass production technical issues.

Manage local R&D team, formulate R&D standards, coordinate local supply chain to realize localized mass production.

Track frontier industry technology, carry out technical pre-research and patent layout to boost business commercialization.

Requirements

Bachelor or above, major in Mechanics, Automation, Microelectronics, Semiconductor Equipment etc., Master...