Job Description

SiPFAB aims to fill up to three Process Engineer roles. As a Process Engineer specializing in either grinding and dicing or back‑end processes for next‑generation semiconductor packaging, you will lead the development of processes such as flip‑chip bonding, die and wire bonding, screen printing, reflow, sintering, dispensing, encapsulation or dicing and grinding within our semiconductor packaging pilot‑line environment. You will also play a key part in process control, tool procurement, safety, user training and equipment lifecycle management ensuring a robust and scalable process foundation for SiPFAB.

Your Key Responsibilities

• Establishing, developing, and optimizing soldering, sintering, ultrasonic and laser welding or dicing and grinding processes for semiconductor packaging applications.
• Actively contributing to ongoing and future R&D and customer projects.
• Engaging and collaborating with academic, RTO, an...