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Principal Packaging Integration Engineer (2026 New College Graduate)
Global Foundries
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Essex Junction, United States
Location
Essex Junction
Posted
June 20, 2026
Commute
Local Area
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Job Description
About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the worldβs most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary of Role:
GlobalFoundries (GF) seeks a hands-on Assembly Process Integration Engineer that will deliver industry leading electro-optical transceivers using GFβs Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on tool-process interactions for each step in a SiPh Flip Chip assembly, with focus on product and module reliability, package risk factors, packaging design rules, material...
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the worldβs most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary of Role:
GlobalFoundries (GF) seeks a hands-on Assembly Process Integration Engineer that will deliver industry leading electro-optical transceivers using GFβs Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on tool-process interactions for each step in a SiPh Flip Chip assembly, with focus on product and module reliability, package risk factors, packaging design rules, material...