Principal Package Design Engineer

Job Description

We are seeking a Senior Advanced Packaging Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architectures, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.

**Responsibilities**

+ Lead the design, development, and qualification of advanced semiconductor packaging solutions, including:
+ Flip-chip, Chip Embedding
+ Wafer-level packaging (WLP/FOWLP)
+ Panel-level packaging (laminate, molding)
+ 2.5D/3D packaging
+ System-in-package (SiP)
+ Ball grid array (...