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Principal Optical Packaging Engineer
Microsoft Corporation
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Cambridge, United Kingdom
Location
Cambridge
Posted
June 06, 2026
Commute
Local Area
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Job Description
**Overview**
At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, systems, software, and hardware, and we partner with product teams across Microsoft to turn research breakthroughs into impact at scale. Through close collaboration with industry partners, the team bridges research and production, translating hardware innovation into working prototypes and manufacturable solutions for next-generation AI infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design.
We are seeking an experienced Optical Packaging Engineer with deep expertise in co-packaged optics and advanced packaging technologies. The successful candidate will play a critical role in bridging photonic devices, electronic ICs, and system-level integra...
At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, systems, software, and hardware, and we partner with product teams across Microsoft to turn research breakthroughs into impact at scale. Through close collaboration with industry partners, the team bridges research and production, translating hardware innovation into working prototypes and manufacturable solutions for next-generation AI infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design.
We are seeking an experienced Optical Packaging Engineer with deep expertise in co-packaged optics and advanced packaging technologies. The successful candidate will play a critical role in bridging photonic devices, electronic ICs, and system-level integra...