As technical expert, you work in the field of interaction of wafer technology (chip metallization) and interconnect (Die bond, Wire bond) and be part of FE-BE pre development and optimization teams, and actively participate in the FE-BE strategy definition.

Your Role

• Apply your technical knowledge within own optimization projects or as project team member of development projects with FE-BE and platform overarching impact.
• Ensure cost effective production by fostering reuse and avoiding complexity before production release.
• Act as an entrepreneur and technical leader in the area of innovation & implementation (leading as expert, generate & file inventions).
• Closely cooperate with worldwide Infineon wafer fab and backend sites.
• Drive & define the process guideline documentation out of lessons learnt for interaction between chip and assembly.
• Share the know-how concerning process block interactions as trainer.
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