ESSENTIAL DUTIES AND RESPONSIBILITIES

• Develops and leads SiP (System in Package) assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
• Leads new package and SMT/Flip Chip/Underfill process qualification programs.
• Develops and maintain process documentation, including standard operating procedures and work instructions.
• Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
• Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity utilizing statistical knowledge, and problem‑solving tools.
• Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start‑up.
• Acts as a liaison with suppliers/vendors.
• Maintains product quality while developing...