**Job Details:**

**Job Description:**

As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling next-generation advanced packaging technologies that enable Intel's leadership in high-performance computing, AI, and chiplet architectures.
This role operates at the intersection of pathfinding, technology development, and manufacturing, with responsibility for driving hybrid bonding capability from first-of-a-kind (FOK) platform development through qualification, ramp, and high-volume manufacturing (HVM). You will bring deep industry expertise in hybrid bonding equipment and process development, yield and reliability improvement, and platform innovation, helping Intel deliver robust, scalable solutions across multiple products and sites.
Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading per...