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PIM (Si Gel Filled) Power Module Development Engineer

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Onsemi
📍 Dongguan Shi, China
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Location Dongguan Shi
📅
Posted June 19, 2026
🚗
Commute Local Area
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Job Description

  • New package technology and platform module development (Si-gel filled module).
  • Technical leadership on new power module technology and enabling technology for automotive/industrial application.
  • Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
  • Package/design review for new package development, on-tme release with the first pass success (qualification).
  • Present technical finding, design review and recommendation to stakeholders and management.
  • Lead package related failure analysis, reliability testing and debug package issues.
  • Participate in customer meeting, provide technical clarification and support failure investigation.
  • Define power module package strategy aligned with product roadmap.
  • Own end-to-end package development from concept to qualification upon company's package development procedures.
  • Ens...

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    📍 Location Details

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    City
    Dongguan Shi
    🗺️
    Country
    China
    🚗
    Commute
    Local Area

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