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Photonic Process Engineer: Wire Bonding & Die Attach

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Ciena Corporation
πŸ“ ottawa, Canada
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Location ottawa
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Posted June 01, 2026
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Commute Local Area
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Job Description

A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.
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πŸ“ Location Details

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City
ottawa
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Country
Canada
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Commute
Local Area

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