Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability. By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.

Key Responsibilities:

• Design and develop assembly processes and equipment to enable future packaging technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Create and maintain specifications for proces...