• Participate in the development of package design and advanced substrate layout for products.
• Learn and become proficient in EDA layout tools (e.g., Cadence SIP/Allegro) to perform package and substrate drawing, design modifications, and related engineering tasks.
• Perform basic routing planning, layer stack‑up configuration, and design‑for‑manufacturability (DFM) checks based on established design rules and manufacturing requirements.
• Collaborate with cross‑functional engineering teams—including hardware, manufacturing, and packaging—to support package structure evaluations, design updates, and issue resolution.

Required Qualifications: 

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, or other related engineering/science fields.
• Coursework, project experience,...