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Packaging Engineer - Inductor and Power Module

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Texas Instruments
πŸ“ Taiwan, Taiwan
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Location Taiwan
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Posted May 29, 2026
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Commute Local Area
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Job Description

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist

+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
+ Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.

The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.

**Why TI?**

+ E...

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πŸ“ Location Details

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City
Taiwan
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Country
Taiwan
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Commute
Local Area

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