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Packaging Engineer - Inductor and Power Module
Texas Instruments
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Santa Clara, United States
Location
Santa Clara
Posted
June 01, 2026
Commute
Local Area
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Job Description
**Change the world. Love your job.**
The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
**Responsibilities may include:**
+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure.
+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
+ Ensure manufacturability...
The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
**Responsibilities may include:**
+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure.
+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
+ Ensure manufacturability...