Role and Impact

Join Intel's Advanced Packaging team as a Manufacturing Failure Analysis Engineer, where you will play a critical role in shaping the future of semiconductor manufacturing. This position is pivotal in ensuring the success of Intel's IDM 2.0 strategy and its global leadership in advanced packaging technologies. You will be instrumental in identifying and resolving failures across next‑generation product, package, platform, and board process technologies to drive improvements in quality, yield, and reliability. Your expertise will directly contribute to innovative solutions that help connect and enrich the lives of people around the world.

Key Responsibilities

• Conduct failure analysis to identify root causes of issues in manufacturing processes, products, and technologies.
• Define failure analysis strategies and execute lab work to evaluate electrical and mechanical characteristics of integrated circuits, components, and sy...