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Lead Platform Packaging Engineer

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Infineon Technologies AG
πŸ“ malacca city, Malaysia
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Location malacca city
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Posted June 03, 2026
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Commute Local Area
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Job Description

Infineon Technologies AG in Malacca City is seeking a Package Design Engineer to lead technical definition activities for packaging projects. Candidates should have a Bachelor’s Degree in Engineering and at least 9 years of relevant experience in the IC/semiconductor field.

The role entails generating internal drawings, defining package requirements, and coordinating cost estimates. Infineon values diversity and offers an inclusive work environment.

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πŸ“ Location Details

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City
malacca city
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Country
Malaysia
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Commute
Local Area

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