Location
Jiangmen
Posted
June 21, 2026
Commute
Local Area
Local Opportunity Near You!
This job is in your area. Enjoy a short commute and work close to home.
Job Description
1. 熟悉相关站点流程，以下一种或者多种
1.1 die bonding, wire bonding；
1.2 wafer mount, wafer sawing；
1.3 molding, trim&form；
1.4 MOSFET final test及打标
2. 熟悉相关站点机器操作（东京精密，ASMPT，Disco，K&S，TOWA等）
3. 熟悉相关材料及tooling
4. 处理生产异常，改善制程以提升良率及降低成本
5. 配合客户audit
6. 制定及维护作业规范