Project Title: NAND Advanced CMOS Metal‑Short Reliability Study and Process Improvement Exploration

Location: 1 North Coast Drive, Singapore

Department: Product Integration Engineering (PIE), Process Integration (PI)

Duration: Minimum 5 months full‑time (Preferred period: July–November 2026)

• Fundamentals of CMOS metallisation processes and process interactions
• Overview of process evaluation changes and their impact on wafer characteristics
• Introduction to Failure Analysis characterisation concepts and fail‑model development approaches
• Familiarisation with Micron in‑house SMAI analytics tools and dashboards
• Learning opportunities to observe cross‑functional collaboration within Process Integration and related engineering teams

• Learning documentation summarising reliability fail mechanisms studied...