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Intern- Backend Assembly Ball Attach Equipment
1480 Micron Semiconductor Mala
📍
muar, Malaysia
Location
muar
Posted
May 29, 2026
Commute
Local Area
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This job is in your area. Enjoy a short commute and work close to home.
Job Description
Overview
Project Title: Ball Attach MTBA Improvement (Aurigin / ZenVoce). Support systematic MTBA improvement for Ball Attach equipment platforms by identifying top assist contributors, driving data‑driven root cause consolidation, and tracking sustained improvement actions. The project directly supports MMY’s SBP OEE and MTBA improvement strategy to strengthen manufacturing efficiency and stability.
Scope
- Identify and analyze top MTBA detractors: alarms, assists, minor stops
- Track MTBA trends by machine, platform, and time (pre‑ and post‑improvement)
- Consolidate recurring alarms and assists into a simple Pareto tree
- Support data‑driven root cause analysis and action definition
- Track action items: owner, status, closure and effectiveness
- Assist in before/after result validation using existing dashboards
- Prepare slide‑ready weekly updates for Equipment Engineering and management review