IC Package Tech Lead
France – Hybrid working
High competitive salary plus employee benefits

Job Description:
•Drive, in close collaboration with the assembly centers (in Europe and Asia) and with our design/R&D team, the specifications of the package of the ICs
•Participate with our IC design team to the definition and/or design of reliable Ball Grid Array package substrates, using specific electrical CAD tools
•Prepare the relevant documentation for BGA substrate design approval and substrate first procurement in accordance.
•Drive advanced package material selection through standard and innovative solutions to meet the total product package performance requirements across the product application domains
•Perform feasibility studies for early assessment of substrate technology and electrical performances
•Cooperate with assembly center R&D teams for continuous design performance improvement
•Drive and/or execute Mechanical, The...