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IC Package Design Engineer

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HCLTech
πŸ“ Bengaluru, India
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Location Bengaluru
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Posted June 03, 2026
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Commute Local Area
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Job Description

Walk-In Drive: IC Package Design Engineer (3+ Years)

πŸš€ Weekend Hiring Drive – HCLTech | Bangalore (Jigani Campus)

HCLTech is hiring skilled professionals for the role of IC Package Design Engineer. If you have a passion for advanced package and PCB design, we invite you to attend our walk-in drive!

πŸ“… Interview Details

  • Date: 16 May 2026 (Saturday)
  • Time: 9:00 AM – 2:00 PM
  • Venue: Tower 4, GF cafΓ© 3 , HCLTech, Jigani Campus, Bangalore
  • Mode: Face-to-Face (F2F)
  • SPOC: Mareeswari C M

πŸ’Ό Role: IC Package Design Engineer

Experience: 3+ Years

πŸ”§ Key Responsibilities & Required Skills

  • Strong experience in IC Package / Substrate Design (mandatory)
  • Hands-on experience with Cadence APD (Allegro Package Designer)
  • Good understanding of package/substrate design and assembly rules, especial...

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πŸ“ Location Details

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City
Bengaluru
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Country
India
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Commute
Local Area

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