Job Summary: 

· New Package Technology and New Platform Module Development 

o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP). 

o Good understanding of MRS and generate PRS with SCD definition. 

o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal. 

o Familiar with DFM, to secure robust manufacturability with quality requirements. 

o Good understanding of power module package design rule, design rule update with new platform development. 

o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, . 

o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, . 

o Drive problem solving methodology wi...