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Engr Prin, Package Development (NPI Mold Engineer)

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Onsemi
📍 Seremban, Malaysia
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Location Seremban
📅
Posted June 07, 2026
🚗
Commute Local Area
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This job is in your area. Enjoy a short commute and work close to home.

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Job Description

Job Summary: 

· Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. 


· Key person responsible to align processes between R&D and Manufacturing. 


· Establish process POR through set up, feasibility and characterization followed by package development procedure. 

Responsibilities


· End of Line process development and enabling technology for molded package. 


o Capable to understand the design and proposal for improvement from End of Line process. 


o Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA. 


o Familiar with EMC materials. 


o Capability to define KPIV from failures modes. 


o Capability to define KPOV and generate output by analyzing process capability. 


o Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab). 


o Effectively working wi...

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📍 Location Details

🌆
City
Seremban
🗺️
Country
Malaysia
🚗
Commute
Local Area

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