Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Thermal Mechanical Simulation Engineer you will be responsible for developing new and derivative process and product-level advanced HBM technologies driving Micron’s advantage by designing premier packages in the Advanced Packaging Technology and Development team. In this position, the engineer will be influencing Thermo-mechanical, thermal and fluid designs, finding efficient package structure and materials to mitigate any potential issues. The scope of the engineer’s work is to address all Thermo-mechanical, thermal and fluidic aspects of and 3D advanced packaging development that is associated with design, material and process interactions. This positio...