Job Responsibilities

• Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes
• Manage and develop a team of engineers and technicians in a high‑volume manufacturing environment
• Drive excellence in output, quality, cost, equipment uptime, and safety
• Ensure robust process control, stability, and integration across wet etch and plating operations
• Lead root‑cause investigations for process, quality, and equipment issues and drive permanent corrective actions
• Drive yield improvement, scrap reduction, and defect reduction through data‑driven analysis
• Ensure high equipment availability and reliability, particularly for wet benches and plating tools
• Apply and sustain SPC and statistical analysis tools to monitor and improve process performance
• Actively contribute to continuous improvement programs to resolve chronic manufacturing or quality iss...