**Description:** The Fleet Ballistic Missile Avionics team is seeking an experienced **Electronics Packaging Engineer** who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use.
Location: **This position does not support teleworking** ; you will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time.
- - -
**What does this role look like?**
• Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations.
• Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. You will support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
• Establish specification...