**Description:** The Fleet Ballistic Missile Avionics team is seeking an experienced **Electronics Packaging Engineer** who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use.
Location: **This position does not support teleworking** ; you will be located near our Lockheed Martin Space facility in: Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time.
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**What does this role look like?**
• Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations.
• You will coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. You will support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
• You will estab...