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Direct Lid/Stiffener Attach Packaging Module Development Engineer

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Intel Corporation
πŸ“ , , malaysia, Malaysia
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Location , , malaysia
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Posted June 05, 2026
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Commute Local Area
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Job Description

## Direct Lid/Stiffener Attach Packaging Module Development EngineerApplylocations: Malaysia, Kulimtime type: Full timeposted on: Posted Todayjob requisition id: JR # **Job Details:**## Job Description:The position is for Package Module Development Engineer for direct lid/stiffener attach module as part of ATD (Assembly Technology Development) in Asia initiative. The candidate will define and establish process flow, conduct FMEA assessment, procedures, drawings review and equipment configuration for NPI products.* Selects and develops material and equipment (recipe, collaterals based on design rules) and drives improvement for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements over variables such as material, method, equipment, environment and operating personnel.* Plans and conduct experiments to fully characterize the process throughout the development cycle.* Develops solutions to problems utilizing formal education, statis...

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πŸ“ Location Details

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City
, , malaysia
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Country
Malaysia
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Commute
Local Area

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